发明名称 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
摘要 In the field of printed circuit boards and circuit boards, the present invention has excellent glass cloth impregnating abilities and prepreg appearance, and exhibits excellent heat resistance in a cured product thereof. The present invention provides a phosphorus atom-containing phenol resin which has a phosphorus atom-containing structural site (i) represented by structural formula (Y1) or (Y2) (In the structural formulas (Y1) and (Y2), R1 to R4 are each independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.) and an alkoxymethyl group (ii) in an aromatic nucleus of a phenol compound, wherein the percentage of the number of the alkoxymethyl groups (ii) with respect to the total number of the phosphorus atom-containing structural sites (i) and the alkoxymethyl groups (ii) is 5 to 20%.
申请公布号 WO2013145950(A1) 申请公布日期 2013.10.03
申请号 WO2013JP54156 申请日期 2013.02.20
申请人 DIC CORPORATION 发明人 MURATA YOSHIAKI;NAKAMURA TAKAMITSU;HAYASHI KOJI
分类号 C08G59/62;H05K1/03 主分类号 C08G59/62
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