发明名称 SUBSTRATE STICKING METHOD AND SUBSTRATE STICKING DEVICE
摘要 PROBLEM TO BE SOLVED: To regulate protrusion of an adhesive agent from an outer periphery part of a substrate within predetermined width.SOLUTION: In a substrate sticking method for sticking a plurality of substrates, a photo-curing type adhesive agent 3, disposed between a plurality of substrates 1 and 2 by an overlapping process, is spread toward an outer periphery from a center of one joint surface 1a of the plurality of substrates 1 and 2, and an amount of protrusion is reduced as much as possible by irradiating light toward a side face of the outer periphery of the adhesive agent 3 by a light irradiating process, even if the adhesive agent 3 protrudes from an outer periphery part of the plurality of substrates 1 and 2.
申请公布号 JP2013200430(A) 申请公布日期 2013.10.03
申请号 JP20120068425 申请日期 2012.03.23
申请人 TOHOKU PIONEER EG CORP 发明人 HORII TOSHITAKA
分类号 G02F1/1339;G02F1/13;G02F1/1333;G09F9/00 主分类号 G02F1/1339
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