ALKOXYSILYL GROUP-CONTAINING SILANE-MODIFIED POLYIMIDE RESIN, RESIN VARNISH, POLYIMIDE-BASED ADHESIVE, CURED PRODUCT, ADHESIVE SHEET, LAMINATE AND FLEXIBLE PRINTED BOARD

摘要

PROBLEM TO BE SOLVED: To provide a new polyimide-based adhesive which can be used as a homogeneous solution in an organic solvent (resin varnish), exhibits excellent initial adhesiveness and heat resistant adhesiveness to various base materials, and leaves little adhesive residue.SOLUTION: An alkoxysilyl group-containing silane-modified polyimide resin [1] is obtained by reacting a polyimide resin (A), which is prepared by reacting aromatic tetracarboxylic acids (a1) and diamines (a2) including ≥30 mol% of a dimer diamine, with an epoxy group-containing alkoxysilane partial condensate (a3). An alkoxysilyl group-containing silane-modified polyimide resin [2] is obtained by subjecting a polyimide resin, which is prepared by reacting aromatic tetracarboxylic acids (a1) and diamines (a2) including ≥30 mol% of a dimer diamine, to chain elongation with the diamines (a2), and further reacting the resulting polyimide resin (A') with an epoxy group-containing alkoxysilane partial condensate (a3).