| 摘要 |
The present invention relates to: a curable heat radiation composition which comprises two types of fillers with different compressive crush strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive crush strength ratio of the two types of fillers [compressive crush strength of a filler (A) with a high compressive crush strength / compressive crush strength of a filler (B) with a low compressive crush strength] being 5 to 1,500, the compressive crush strength of the filler (A) being 100 to 1,500 MPa, and the compressive crush strength of the filler (B) being 1.0 to 20 MPa; an adhesive sheet using the composition and a method for producing the same; and a heat radiation cured product obtained by curing the composition. This curable heat radiation composition has excellent heat radiation properties in the thickness direction, has a wide tolerance range (margin) for compression molding conditions, and can be suitably used as an adhesive for electronic and electrical components. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B). |
