| 摘要 |
A method of manufacturing a semiconductor device in which the alignment accuracy of an immersion exposure device is maintained even when exposure steps are carried out intermittently. In the method, a substrate is placed on a stage of an exposure device (substrate placing step). Then, a first liquid is supplied to between the substrate and the optics system of the exposure device to expose the substrate through the first liquid (exposure step). A second liquid is supplied from a different place from the first liquid to a drainage groove provided around the stage at least in a period other than when the first liquid is supplied onto the stage, in order to suppress change in the temperature of the exposure device. |
