SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

摘要

A substrate processing device (1) includes: a substrate holding unit (5) that holds a substrate in a horizontal attitude; a plate (8) having a horizontal flat liquid holding face (11) facing the bottom of the main face of the substrate and having a size that is equal to the main face of the substrate that is held on the substrate holding unit (5) or a size that is larger than this main face; a processing liquid supply unit (20) for supplying processing liquid to the liquid holding face (11); a movement unit (29) for moving closer/further apart the main face of the substrate and the liquid holding face by relative movement of the substrate holding unit (5) and the plate (8); and a control unit (50). By controlling the processing liquid supply unit (20) and the movement unit (29), the control unit executes: a processing liquid film forming step of forming a processing liquid film on the liquid holding face by supplying processing liquid to the liquid holding face (11) by the processing liquid supply unit (20); a contact step of bringing the main face of the substrate into contact with the processing liquid film by moving the main face of the substrate and the liquid holding face (11) closer together by means of the movement unit (29); and a step of maintaining wetting in which a condition of wetting the main face of the substrate by the processing liquid is maintained, after the contact step.