| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin liquid sealing material for underfilling, which can be cured in a short time at low temperature, can be filled in even a narrow gap in a few minutes at room temperature, and is excellent in temperature cycling resistance.SOLUTION: An epoxy resin liquid sealing material for underfilling comprises an epoxy resin (A), a compound (B) having a phosphoester group, and a latent curing agent (C). The compound (B) having the phosphoester group is used as a wetting dispersant. The epoxy resin liquid sealing material further comprises an inorganic filler (D). A reactant of the epoxy resin with an amine compound is used as the latent curing agent (C). |
