ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, which has excellent peelability.SOLUTION: An adhesive sheet 10 for manufacturing a semiconductor device includes a base material and an adhesive layer including a resin provided on one surface of the base material, and is detachably attached to a lead frame 20 or a wiring board of the semiconductor device. The adhesive layer is mixed with a fluorine-containing additive which is liquid at 25°C. It is preferable that the resin contains styrene-ethylene-butylene-styrene copolymer and the adhesive layer is mixed with a curative agent.