发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor package according to embodiments includes: a semiconductor chip including a front electrode on a front surface thereof and a back electrode on a back surface thereof; a front-side cap portion including an air gap in a portion between the semiconductor chip and the front-side cap portion and a front-side penetrating electrode, and is positioned to face the front surface of the semiconductor chip; a back-side cap portion bonded with a first cap portion to hermetically seal the semiconductor chip, includes an air gap at least in a portion between the semiconductor chip and the back-side cap portion and a back-side penetrating electrode, and is positioned to face the back surface of the semiconductor chip; a front-side connecting portion which electrically connects the front electrode and the front-side penetrating electrode; and a back-side connecting portion which electrically connects the back electrode and the back-side penetrating electrode.
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申请公布号 |
US2013256864(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201213688823 |
申请日期 |
2012.11.29 |
申请人 |
NAGANO TOSHIHIKO;ABE KAZUHIDE;YAMADA HIROSHI;ITAYA KAZUHIKO;NAKADA TAIHEI |
发明人 |
NAGANO TOSHIHIKO;ABE KAZUHIDE;YAMADA HIROSHI;ITAYA KAZUHIKO;NAKADA TAIHEI |
分类号 |
H01L23/48;H01L21/78 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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