RESIST ADHESION IMPROVER AND METHOD FOR PRODUCING COPPER WIRING LINE

摘要

A resist adhesion improver which contains 1.5-20% by weight of an organic acid, 0.0007-0.73% by weight of chloride ions and 0.00003-3.7% by weight of ammonium ions, with the balance made up of water, and wherein the molar concentration ratio of the chloride ions to the ammonium ions is within the range of 0.1-10; and a method for producing a copper wiring line, wherein when a photosensitive resist film is formed on a copper film, the copper film surface is processed using the resist adhesion improver and then the photosensitive resist film is formed on the copper film. Consequently, adhesion of the photosensitive resist to the copper film surface is improved.