<p>PURPOSE: A film attaching method is provided to attach a thin film on a substrate with ease by attaching the thin film on the support film and to prevent bending of the thin film generated when the thin film is attached. CONSTITUTION: A film attaching method includes the following steps. A thin film with a thickness less than 100 micrometer is attached on a side of a support form (S10). The other side of the support film is attached on one side of a carried substrate through an adhering material (S20). The attachment state attaches the thin film and the support film through a static generated between the thin film and the support film. [Reference numerals] (S10) Step of attaching; (S20) Step of adhering</p>
申请公布号
KR20130107505(A)
申请公布日期
2013.10.02
申请号
KR20120029349
申请日期
2012.03.22
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, CHOONG HEE;KIM, SEUL GI;KIM, JAE HUN;HONG, SANG SU;YANG, CHUNG MO