Plattierelement und Verfahren zum Herstellen desselben

摘要

A plating member comprising a lead-free plating material is obtained by the present invention in a manner such that whisker formation on a plating layer 16 of the plating member can be suppressed and thus the plating member has good solderability. In the case of such plating member having, on the surface of a base material 15, a plating layer 16 comprising a lead-free material (Sn—Cu alloy, etc.), the plating layer 16 has a layer structure of two or more layers (a1 to a3), the average particle diameter of plating particles (P1 to P3) constituting each layer varies from layer to layer, and the plating particle volume fraction of the plating layer 16 is 80% to 90% when the proportion of plating particles occupying a unit volume is defined as a plating particle volume fraction of 100% on the assumption that a unit volume 20 is filled with plating particles P3 each having the maximum average particle diameter.