| 发明名称 |
RESIN COMPOSITION, INSULATING FILM, FILM FORMING METHOD, AND ELECTRONIC COMPONENT |
| 摘要 |
<p>A resin composition containing: a polymer having at least one structural unit (i) selected from a group consisting of a structural unit represented by formula (1) and a structural unit represented by formula (2); and at least one organic solvent selected from a group consisting of ether solvents, ketone solvents, ester solvents and amide solvents.</p> |
| 申请公布号 |
EP2644654(A1) |
申请公布日期 |
2013.10.02 |
| 申请号 |
EP20110843275 |
申请日期 |
2011.11.22 |
| 申请人 |
JSR CORPORATION |
发明人 |
OKANIWA, MOTOKI;UNO, TAKAAKI;OKADA, TAKASHI |
| 分类号 |
C08L71/10;H01L21/312 |
主分类号 |
C08L71/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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