| 摘要 |
Forming antenna structures (420) having turns of wire (110), foil or conductive material (244) on a an antenna substrate (402) or in a layer of adhesive layer (274) on a carrier substrate (252), transferring the antenna structures individually (FIGs. 5A) or many at once (FIG. 6F) to corresponding transponder sites (404) on an inlay substrate (402) and connecting the aligned termination ends (420a/b) of the antenna structures to terminal areas (408a/b) of RFID chip modules (408) at the transponder sites. Transferring may be performed by laminating (heat and pressure). The antenna substrate may be in web format (FIGs. 4A, 5E) or sheet format (FIG. 6D). Automated manufacturing procedures are disclosed. Kits having components (800, 810, 820, 830, 840, 850, 860) for manufacturing inlay substrates, inlays and secure documents are disclosed. Various features (FIGs. 9A-9J) of an inlay substrate and chip module are disclosed. |
