发明名称 |
METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS |
摘要 |
PURPOSE: A method for manufacturing a chemical machine polishing layer is provided to minimize or remove undesirable density defects, thereby minimizing the surface illumination of the surface of the polishing layer. CONSTITUTION: A method for manufacturing a chemical machine polishing layer includes the following steps of: preparing a mold base (2) and a mold (1) having a wall (8) attached to the mold base; preparing a linear (4) having a mean thickness of 2-10 cm, an upper surface (6), and a lower surface (3); providing an adhesive (7) and curable materials including a pre-polymer; providing a nozzle with a nozzle opening; providing a skiver blade with a cut edge portion; forming a mold cavity with the upper surface and the wall of the linear by joining the lower surface of the linear to the mold base with the adhesive; charging the curable materials into the mold cavity via the nozzle opening for a charging period; and hardening the curable materials inside the mold cavity into a cake; and separating the wall from the mold base and the cake. |
申请公布号 |
KR20130108168(A) |
申请公布日期 |
2013.10.02 |
申请号 |
KR20130030670 |
申请日期 |
2013.03.22 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
CANTRELL BRIAN;MCHUGH KATHLEEN;MURNANE JAMES;MCCLAIN GEORGE;HUTT DURRON;BRADY ROBERT A.;YOUNG CHRISTOPHER A.;MILLER JEFFREY BORCHERDT |
分类号 |
B24D7/12;B24B37/24;B24D3/20;C09K3/14 |
主分类号 |
B24D7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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