发明名称 METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING LAYERS
摘要 PURPOSE: A method for manufacturing a chemical machine polishing layer is provided to minimize or remove undesirable density defects, thereby minimizing the surface illumination of the surface of the polishing layer. CONSTITUTION: A method for manufacturing a chemical machine polishing layer includes the following steps of: preparing a mold base (2) and a mold (1) having a wall (8) attached to the mold base; preparing a linear (4) having a mean thickness of 2-10 cm, an upper surface (6), and a lower surface (3); providing an adhesive (7) and curable materials including a pre-polymer; providing a nozzle with a nozzle opening; providing a skiver blade with a cut edge portion; forming a mold cavity with the upper surface and the wall of the linear by joining the lower surface of the linear to the mold base with the adhesive; charging the curable materials into the mold cavity via the nozzle opening for a charging period; and hardening the curable materials inside the mold cavity into a cake; and separating the wall from the mold base and the cake.
申请公布号 KR20130108168(A) 申请公布日期 2013.10.02
申请号 KR20130030670 申请日期 2013.03.22
申请人 ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 发明人 CANTRELL BRIAN;MCHUGH KATHLEEN;MURNANE JAMES;MCCLAIN GEORGE;HUTT DURRON;BRADY ROBERT A.;YOUNG CHRISTOPHER A.;MILLER JEFFREY BORCHERDT
分类号 B24D7/12;B24B37/24;B24D3/20;C09K3/14 主分类号 B24D7/12
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