| 摘要 |
PURPOSE: A component mounting method is provided to reduce the processing time by inspecting the component arrangement status at the same time when a shield case is mounted on a PCB. CONSTITUTION: Using a first camera, first arrangement data of a component is extracted and stored (S110). Based on the first arrangement data, the position of the component on a substrate is corrected (S120). The component is mounted on the substrate (S130). Using a second camera, the arrangement status of the substrate and the component is inspected. The inspection determines an offset value (S140). [Reference numerals] (AA) Start; (BB) End; (S110) Using a first camera, first arrangement data of a component is extracted and stored; (S120) Based on the first arrangement data, the position of the component on a substrate is corrected; (S130) Component is mounted on the substrate; (S140) Using a second camera, the arrangement status of the substrate and the component is inspected based on the first arrangement data to determine an offset value; (S150) Based on the offset value, the arrange status of the component is determined |
