| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conductive silicone composition and a cured product of the same achieving heat conductivity of 1.5 W/mK or more and reducing wear of a reactor and a stirring blade in production and sedimentation of a heat conductive filler, preferably by skillfully combining aluminum hydroxides varying in particle size. SOLUTION: The heat conductive silicone composition comprises: (A) 100 pts.mass of an organopolysiloxane having at least two alkenyl groups in the molecule; (B) an organohydrogen polysiloxane having at least two hydrogen atoms directly bonded to a silicon atom; (C) 200-2,500 pts.mass of a heat conductive filler wherein 70 mass% or more is occupied by an aluminum hydroxide; and (D) a platinum group metal curing catalyst. The content of the component (B) is set so that the number of moles of the hydrogen atoms directly bonded to the silicon atom is 0.1-5.0 times that of the alkenyl groups originated from the component (A). The content of the component (D) is 0.1-1,000 ppm in the mass terms of platinum group metal elements with respect to the component (A). COPYRIGHT: (C)2011,JPO&INPIT
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