发明名称 |
Package substrate having die pad with outer raised portion and interior recessed portion |
摘要 |
A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.
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申请公布号 |
US8546184(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US201313734239 |
申请日期 |
2013.01.04 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HO CHIH-CHIEN;JEN SAIHSI;HSIEH ERIC |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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