发明名称 |
Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor |
摘要 |
In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.
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申请公布号 |
US8547683(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US20100821305 |
申请日期 |
2010.06.23 |
申请人 |
SARUBAN MASAHITO;OGAWA MAKOTO;IWANAGA TOSHIYUKI;MATSUMOTO SEIICHI;MOTOKI AKIHIRO;TAKEUCHI SHUNSUKE;NISHIHARA SEIICHI;KAWASAKI KENICHI;MURATA MANUFACTURING CO., LTD. |
发明人 |
SARUBAN MASAHITO;OGAWA MAKOTO;IWANAGA TOSHIYUKI;MATSUMOTO SEIICHI;MOTOKI AKIHIRO;TAKEUCHI SHUNSUKE;NISHIHARA SEIICHI;KAWASAKI KENICHI |
分类号 |
H01G4/228;H01G4/06;H01G7/00 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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