发明名称 Laminated ceramic electronic component with directly plated external terminal electrodes and manufacturing method therefor
摘要 In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrodes primarily including nickel are exposed, when a heat treatment at a temperature of about 800° C. or more is applied in order to improve adhesion strength and resistance to moisture of the external terminal electrode, voids may occur in the plating layer. The step of applying a heat treatment at a temperature of about 800° C. or more to a component main body with plating layers formed thereon includes not only a step of maintaining a top temperature of about 1000° C. or more but also a step of maintaining a temperature of about 600° C. to 900° C. at least once before the step of maintaining the top temperature.
申请公布号 US8547683(B2) 申请公布日期 2013.10.01
申请号 US20100821305 申请日期 2010.06.23
申请人 SARUBAN MASAHITO;OGAWA MAKOTO;IWANAGA TOSHIYUKI;MATSUMOTO SEIICHI;MOTOKI AKIHIRO;TAKEUCHI SHUNSUKE;NISHIHARA SEIICHI;KAWASAKI KENICHI;MURATA MANUFACTURING CO., LTD. 发明人 SARUBAN MASAHITO;OGAWA MAKOTO;IWANAGA TOSHIYUKI;MATSUMOTO SEIICHI;MOTOKI AKIHIRO;TAKEUCHI SHUNSUKE;NISHIHARA SEIICHI;KAWASAKI KENICHI
分类号 H01G4/228;H01G4/06;H01G7/00 主分类号 H01G4/228
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