发明名称 NOZZLE OF RESIN APPLYING APPARATUS
摘要 PURPOSE: A nozzle of a resin-spreading apparatus conducts a spread process to a substrate on which the array spacing of semiconductors is different from each other without replacing the whole of nozzles. CONSTITUTION: A nozzle of a resin-spreading apparatus comprises a first member (71) which has a connection hole (711) connected to a resin supply line (61); a second member (73) which is coupled to the first member and forms a space (C) accommodating the resin supplied through the connection hole between the first member and it; and a third member (73) which is inserted between the first member and the second member and in which a plurality of outlets (735) are formed. An insertion part (717,727) is formed in the first member and/or second member to make at least a part of the third member to be inserted.
申请公布号 KR20130106987(A) 申请公布日期 2013.10.01
申请号 KR20120028727 申请日期 2012.03.21
申请人 TOP ENGINEERING CO., LTD. 发明人 CHOI, KWANG SIK
分类号 B05C5/02;B05C11/00 主分类号 B05C5/02
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