发明名称 |
SEMICONDUCTOR PACKAGE SLIMING APPARATUS AND METHOD OF THE SAME |
摘要 |
PURPOSE: A semiconductor package slimming apparatus and a method thereof are provided to perform a uniform polishing process by controlling the height of a grindstone in real time according to various shapes. CONSTITUTION: A table (10) vacuum-adsorbs a semiconductor package. A grindstone (21) polishes the adsorbed semiconductor package. A control device displaces the grindstone. The control device includes a sensor (41) and a driving part. The sensor measures the height of the semiconductor package in real time. |
申请公布号 |
KR20130107026(A) |
申请公布日期 |
2013.10.01 |
申请号 |
KR20120028790 |
申请日期 |
2012.03.21 |
申请人 |
KNJ CO., LTD. |
发明人 |
BAE, GI HWAN;KIM, SANG KEUN;LEE, WOO DONG |
分类号 |
H01L21/304;H01L21/02;H01L23/12 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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