发明名称 Suspension board with circuit having an electrically conductive layer interposed between a support terminal and metal plating layer
摘要 A suspension board with circuit includes a metal supporting board; an insulating layer formed on the metal supporting board having an opening penetrating in the thickness direction formed therein; and a conductive pattern formed on the insulating layer including an external-side terminal electrically connected to an external board. The external-side terminal is filled in the opening of the insulating layer. In the metal supporting board, a support terminal electrically insulated from the surrounding metal supporting board and electrically connected to the external-side terminal is provided. The suspension board with circuit includes a metal plating layer formed below the support terminal and an electrically-conductive layer interposed between the support terminal and the metal plating layer having a thickness of 10 nm or more to 200 nm or less.
申请公布号 US8547663(B2) 申请公布日期 2013.10.01
申请号 US201113317599 申请日期 2011.10.24
申请人 SUGIMOTO YUU;NITTO DENKO CORPORATION 发明人 SUGIMOTO YUU
分类号 G11B5/48;H05K1/09 主分类号 G11B5/48
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