发明名称 |
Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device |
摘要 |
Disclosed is a granular resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, satisfying the following requirements (a) to (c) on condition that ion viscosity is measured with a dielectric analyzer under a measurement temperature of 175° C. and a measurement frequency of 100 10 Hz: (a) the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity is 20 seconds or shorter; (b) the lowest ion viscosity value is not more than 6.5; and (c) the time interval between the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity and the time from the initiation of the measurement until the ion viscosity reaching 90% of an ion viscosity value measured at 300 seconds is 10 seconds or longer.
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申请公布号 |
US8546959(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US200913133752 |
申请日期 |
2009.12.02 |
申请人 |
TSUKURIMICHI KEIICHI;SUMITOMO BAKELITE CO., LTD. |
发明人 |
TSUKURIMICHI KEIICHI |
分类号 |
H01L23/29;B32B5/16;H01L21/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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