发明名称 Power semiconductor device adaptive cooling assembly
摘要 The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100).
申请公布号 US8547687(B2) 申请公布日期 2013.10.01
申请号 US200913122807 申请日期 2009.10.01
申请人 DE RIJCK ALEXANDER CHRISTIAAN;HUISMAN HENDRIK;KONINKLIJKE PHILIPS N.V. 发明人 DE RIJCK ALEXANDER CHRISTIAAN;HUISMAN HENDRIK
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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