发明名称 |
Power semiconductor device adaptive cooling assembly |
摘要 |
The invention relates to a power semiconductor device (100) cooling assembly for cooling a power semiconductor device (100), wherein the assembly comprises an actively cooled heat sink (102) and a controller (208; 300), wherein the controller (208; 300) is adapted for adjusting the cooling efficiency of the heat sink (102) depending on the temperature of the high current carrying semiconductor junction comprised in the power semiconductor device (100). |
申请公布号 |
US8547687(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US200913122807 |
申请日期 |
2009.10.01 |
申请人 |
DE RIJCK ALEXANDER CHRISTIAAN;HUISMAN HENDRIK;KONINKLIJKE PHILIPS N.V. |
发明人 |
DE RIJCK ALEXANDER CHRISTIAAN;HUISMAN HENDRIK |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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