发明名称 Memory element and memory device
摘要 A memory element capable of simultaneously satisfying the number of repeating operation times and a low-voltage operation characteristic which are in a tradeoff relation is provided. The memory element has a high-resistivity layer and an ion source layer between a bottom electrode and a top electrode. The high-resistivity layer is made of an oxide containing Te. Any of elements other than Te such as Al, Zr, Ta, Hf, Si, Ge, Ni, Co, Cu, and Au may be added. In the case of adding Al to Te and also adding Cu and Zr, the composition ratio of the high-resistivity layer is preferably adjusted in the ranges of 30@Te@100 atomic %, 0@Al@70 atomic %, and 0@Cu+Zr@36 atomic % except for oxygen. The ion source layer is made of at least one kind of metal elements and at least one kind of chalcogen elements of Te, S, and Se.
申请公布号 US8547735(B2) 申请公布日期 2013.10.01
申请号 US200913060342 申请日期 2009.08.28
申请人 MIZUGUCHI TETSUYA;YASUDA SHUICHIRO;SASAKI SATOSHI;YAMADA NAOMI;SONY CORPORATION 发明人 MIZUGUCHI TETSUYA;YASUDA SHUICHIRO;SASAKI SATOSHI;YAMADA NAOMI
分类号 G11C11/00 主分类号 G11C11/00
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