SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO-VIAS PARTIALLY THROUGH INSULATING MATERIAL OVER BUMP INTERCONNECT CONDUCTIVE LAYER FOR STRESS RELIEF

摘要

PURPOSE: A semiconductor device and a method for manufacturing the same are provided to easily remove a stress by forming a micro-via made of an insulating material. CONSTITUTION: A conductive layer (134) is formed on a substrate. A first insulation layer (156) is formed on the substrate and a conductive layer. A part of the first insulation layer is removed. First micro-openings are formed in the first insulation layer. An interconnection structure is formed on the conductive layer.