| 摘要 |
A robot arm for delivering a wafer is disclosed which comprises a carrier plate, an inner ring, a driving device and at least a contact pad. The inner ring is disposed on the carrier plate and defines at least a through-hole. The driving device is connected to the carrier plate to move the carrier plate. The contact pad is disposed at the through-hole of the inner ring and comprises a first protrusion portion and a second protrusion portion. The first protrusion portion protrudes from a first surface of the inner ring and is used for being in contact with the wafer to prevent it from being in contact with the first surface. The second protrusion portion is lodged in the through-hole to fix the contact pad at the inner ring.
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