| 摘要 |
<p>PURPOSE: A heating device and a semiconductor manufacturing apparatus are provided to easily control temperature by preventing a high increase in the temperature of the lower part of a hollow shaft. CONSTITUTION: A ceramic body (20) has a disk shape. The ceramic body has a wafer mounting surface. A resistance heating element (22) is installed within the ceramic body or on the surface of the ceramic body. A hollow shaft (40) is bonded to the wafer mounting part and a facing surface. The ceramic body includes a central part and a peripheral part. [Reference numerals] (48) Power source circuit; (50) Controller</p> |
