发明名称 Swing out mold insert device on lay up molds
摘要 An apparatus and method in which an insert with an undercut is mechanically coupled to a lay up mold for translated movement between an engaged position for molding with an undercut engaging the material to be molded and a remote position in which a resultant molded product maybe removed and the material may be laid up without interference with the undercut, preferably with the mechanical coupling allowing for hinged movement of the insert relative the lay up mold.
申请公布号 US8545662(B2) 申请公布日期 2013.10.01
申请号 US201213546283 申请日期 2012.07.11
申请人 JAGOS PAUL D.;QUESNELLE CURTIS SPENCER;SCHMITZ THOMAS;WEBER MANUFACTURING TECHNOLOGIES INC. 发明人 JAGOS PAUL D.;QUESNELLE CURTIS SPENCER;SCHMITZ THOMAS
分类号 B29C70/46 主分类号 B29C70/46
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