发明名称 |
MEMS integrated circuit having backside connections to drive circuitry via MEMS roof layer |
摘要 |
A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Connector posts extends from the drive circuitry layer to a contact pad positioned in a roof of the MEMS layer and through-silicon connectors extending linearly from the contact pad, through the drive circuitry layer and the silicon substrate, towards the backside of the silicon substrate. Each through-silicon connector terminates at a backside integrated circuit contact, such that each integrated circuit contact is electrically connected to the drive circuitry layer via the contact pad positioned in the roof of the MEMS layer.
|
申请公布号 |
US8544989(B2) |
申请公布日期 |
2013.10.01 |
申请号 |
US201113197746 |
申请日期 |
2011.08.03 |
申请人 |
MCAVOY GREGORY JOHN;O'REILLY RONAN PADRAIG SEAN;JOHNSTONE DAVID MCLEOD;SILVERBROOK KIA;ZAMTEC LTD |
发明人 |
MCAVOY GREGORY JOHN;O'REILLY RONAN PADRAIG SEAN;JOHNSTONE DAVID MCLEOD;SILVERBROOK KIA |
分类号 |
B41J2/14;B41J2/16 |
主分类号 |
B41J2/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|