| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package slimming device and method for decreasing a thickness of a semiconductor package by polishing a molding surface of the semiconductor package.SOLUTION: A slimming device 1 for slimming a semiconductor package comprises a table 10 on which the semiconductor package is placed, and polishing means 20 for polishing the semiconductor package placed on the table 10. The polishing means 20 includes a polishing grindstone 21 for polishing the semiconductor package and a spindle 22 for rotating the polishing grindstone 21. |
