发明名称 COOLING STRUCTURE AND ELECTRONIC APPARATUS USING THE SAME
摘要 PROBLEM TO BE SOLVED: To solve the problem that cooling performance is lowered when a cooling structure using an ebullient cooling system is disposed so as to greatly tilt.SOLUTION: A cooling structure 10 includes: a coolant 20; a heat-receiving portion 30 storing the coolant 20, and including a heat-receiving container 31 equipped with a first connection port 35 and a second connection port 36 on a side surface; a first condensation portion 41 disposed vertically above the heat-receiving portion 30; a second condensation portion 42 disposed vertically below the heat-receiving portion 30; a first connecting pipe 51 for connecting the first connection port 35, the first condensation portion 41, and the second condensation portion 42; and a second connecting pipe 52 for connecting the second connection port 36, the first condensation portion 41, and the second condensation portion 42. The first connection port 35 and the second connection port 36 are generally opposed to each other in a horizontal direction, and the first connection port 35 is positioned vertically above the second connection port 36.
申请公布号 JP2013197125(A) 申请公布日期 2013.09.30
申请号 JP20120059554 申请日期 2012.03.16
申请人 NEC CORP 发明人 INABA KENICHI;YOSHIKAWA MINORU;SAKAMOTO HITOSHI;KOMICHIGUCHI AKIRA;MATSUNAGA ARIHITO;CHIBA MASAKI
分类号 H05K7/20;F28D15/02;H01L23/427 主分类号 H05K7/20
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