发明名称 |
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing system which enable effective collection and reuse of an etching process liquid even if the concentration of substrate components becomes higher in the used etching process liquid.SOLUTION: A substrate processing method includes: a process liquid collection step where an etching process liquid used in an etching process of a substrate in a substrate processing mechanism is collected; a process liquid return step where the used and collected etching process liquid is returned to the substrate processing mechanism as a new etching process liquid; and a substrate component removal step where components of the substrate, which exist in the used etching process liquid, is removed before the used and collected etching process liquid is returned to the substrate processing mechanism. |
申请公布号 |
JP2013197360(A) |
申请公布日期 |
2013.09.30 |
申请号 |
JP20120063643 |
申请日期 |
2012.03.21 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
HAYASHI KONOSUKE;MATSUI EMI |
分类号 |
H01L21/306;H01L21/304 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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