发明名称 PLATE THICKNESS MEASUREMENT DEVICE AND PLATE THICKNESS MEASUREMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plate thickness measurement device and a plate thickness measurement method, which enable measurement of a plate thickness at low cost without burdening a worker.SOLUTION: A plate thickness measurement device includes: a hole-diameter measurement mechanism 11, having a measurement part 12 for measuring a hole diameter, for measuring a hole diameter using the measurement part 12 and generating hole diameter data when the measurement part 12 is inserted into a hole 5 disposed in a work material 4; a depth measurement mechanism 15 for measuring the depth from the principle surface 26 of the work material 4 to the measurement part 12 when it is inserted into the hole 5; a support mechanism 14 for movably supporting the hole-diameter measurement mechanism 11 so that the measurement part 12 reaches a back surface 27 side from the principle surface 26 side of the work material 4; and a control device 16 for calculating a thickness of the work material 4 on the basis of the hole-diameter data and the depth data, thereby generating thickness data.
申请公布号 JP2013195412(A) 申请公布日期 2013.09.30
申请号 JP20120066694 申请日期 2012.03.23
申请人 MITSUBISHI HEAVY IND LTD 发明人 IENAGA HIROFUMI;NAKAMURA MIKIO
分类号 G01B21/08;B23Q17/20;G01B5/06;G01B5/12;G01B21/14 主分类号 G01B21/08
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