发明名称 CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a circuit board which uses an insulation material as a base material and enables highly reliable vacuum sealing, and to provide a manufacturing method of the circuit board.SOLUTION: A circuit board 1 includes: a glass substrate 7; a tapered through hole which vertically penetrates through the glass substrate 7; and a through electrode 3 formed by a metal member poured so as to close the through hole. An upper surface of the metal member includes a recessed part 19 that is a depression area having a recessed shape.
申请公布号 JP2013197398(A) 申请公布日期 2013.09.30
申请号 JP20120064261 申请日期 2012.03.21
申请人 SEIKO INSTRUMENTS INC 发明人 KISHI MATSUO;KONISHI MIE;NIWA TAKASHI
分类号 H01L23/04 主分类号 H01L23/04
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