发明名称 HEAT CONDUCTIVE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a heat conductive material having suitable high heat conductivity and molding processability.SOLUTION: A heat conductive material includes two types of resins differed in Tg, resin A and resin B; and boron nitride. The resin A and resin B have a phase separation structure, the boron nitride is eccentrically located in a phase composed of the resin B, and a phase composed of the resin B is a continuous phase. When expressing Tg of the resin A as Tg, Tg of the resin B as Tg, the volume fraction of the resin A in the resins contained in the heat conductive material as &phgr;A, the volume fraction of the resin B as &phgr;B, the melt flow rate at 200°C of the resin as MFR, and the melt flow rate at 200°C of the resin B as MFR, the relations of the following expressions (1)-(3) are satisfied. Tg>Tg≥-30°C (1). (&phgr;B×MFR)/(&phgr;A×MFR)>1.0 (2). TG-Tg>90°C (3).
申请公布号 JP2013194223(A) 申请公布日期 2013.09.30
申请号 JP20120066069 申请日期 2012.03.22
申请人 MITSUBISHI CHEMICALS CORP 发明人 ITO HIROSHI;TEI KOSHI;FUJITA YUJI;TAKAHASHI YUTAKA;SANO HIROSHIGE
分类号 C08L101/12;C08J3/20;C08K3/38;C08L23/12;C08L25/06;C09K5/08 主分类号 C08L101/12
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