COMPOSITE MULTILAYER CHIP PACKAGE COMBINATION

摘要

PROBLEM TO BE SOLVED: To inexpensively achieve a package having a function equal to that of the case of including no poor semiconductor chip even when including a poor semiconductor chip.SOLUTION: A main package 1A includes: a plurality of multi-layered semiconductor chips; and a plurality of first terminals associated with the semiconductor chips different from each other. An additional package 51 includes: an additional semiconductor chip to be replaced with one of the plurality of semiconductor chips in the main package 1A; and at least one second terminal electrically connected to the additional semiconductor chip. The main package 1A and the additional package 51 are disposed in a relative positional relationship selected according to whether the additional semiconductor chip should be replaced with which one of the semiconductor chips in the main package 1A.