| 摘要 |
PURPOSE: A light emitting diode module is provided to easily discharge heat generated from a light emitting diode chip by bonding a heat sink used as a supporting member to a light emitting diode package. CONSTITUTION: A board (100) includes package reception holes and electrode reception holes. The electrode reception holes are located between the package reception holes. Board electrodes (200) are attachable to and detachable from the electrode reception holes. A supporting frame (300) supports the board and the board electrodes. Light emitting diode packages (400) are formed in the package reception holes. [Reference numerals] (AA,BB) Cathode; (CC,DD) Anode |
