| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-reliability alkaline soluble curable resin composition such that the alkaline soluble curable resin composition can be formed on a circuit board with bump electrodes by a coating method or laminating method, then the formed alkaline soluble curable resin composition can have a thickness controlled by alkali etching, and the alkaline soluble curable resin composition is suitable for formation of a permanent film to be used as an insulating material which is insoluble in an alkali etching solution and has superior chemical resistance by curing the alkaline soluble curable resin composition, and to provide a method of manufacturing a circuit board using the same.SOLUTION: There is provided a method of manufacturing a circuit board with a cured material layer that is characterized in: forming a layer of an alkaline soluble curable resin composition 103 on a circuit board with bump electrodes and adjusting a layer of the alkaline soluble curable resin composition 103 to an arbitrary thickness through alkali etching; and then curing the layer of the alkaline soluble curable resin composition 103. |
