SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve a problem that it is difficult to form a uniform ALD/MLD film because an opening of a resist becomes deep when the ALD/MLD film is deposited on lateral faces of the resist and double patterning is performed by using the ALD/MLD film as a mask.SOLUTION: A semiconductor device manufacturing method comprises in deposition of an ALD/MLD film on lateral faces of a resist: depositing a first ALD/MLD film under a first deposition condition at a lower deposition rate in an initial stage; and subsequently depositing a second ALD/MLD film under a second deposition condition at a higher deposition rate than under the first deposition condition.