发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic component mounting device that has a Z-axis drive arranged at a stationary portion so as to enable weight reduction of a movable portion of a pitch modification mechanism between nozzles.SOLUTION: The electronic component mounting device comprises: a fixed head 33 that is movable in a XY direction relative to a substrate 21; a first nozzle unit 35 that is supported by the fixed head and arranged to allow first adsorption nozzles 34A and 34B for adsorbing electronic components to move up and down; a second nozzle unit 37 that is supported by the fixed head to be movable in a direction of pitch modification between nozzles with respect to the first nozzle unit and arranged to allow second adsorption nozzles 36A and 36B for adsorbing the electronic components to move up and down; pitch modification means between nozzles (80 and 83) for relatively moving the second nozzle unit 2 to the first nozzle unit to modify pitches between nozzles; and first and second elevating drive means (45A, 45B, 47A, 47B, 64A,64B, 66A and 66B), arranged in the fixed head, for driving the first and second adsorption nozzles to move up and down.
申请公布号 JP2013197572(A) 申请公布日期 2013.09.30
申请号 JP20120066704 申请日期 2012.03.23
申请人 FUJI MACH MFG CO LTD 发明人 IWASAKI MASATAKA
分类号 H05K13/04 主分类号 H05K13/04
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