| 摘要 |
PROBLEM TO BE SOLVED: To provide a division method for dividing a wafer having a protrusion on a surface thereof at a desired position.SOLUTION: A division method comprises: a division starting groove formation step for forming a division starting groove (D1) along a dividing line (ST) on a surface (W1) of a semiconductor wafer (W); a support board preparation step for preparing a support board (SU) having an outer diameter same as the semiconductor wafer, and a groove (D2) formed on a surface (SU1) of the support board (SU), which corresponds to a bump electrode (B) of the semiconductor wafer so that the bump electrode (B) is buried in the groove (D2); a wafer mounting step for mounting the semiconductor wafer whose surface contacts to a surface of the support board on holding means having a pair of supporting blades (37) to support a support board side; and a division step for applying pressure on the semiconductor wafer supported by the supporting blades with a pressing blade (38) from an upper side so that the semiconductor wafer is divided from the division starting groove along the dividing line. |
