发明名称 SOLDER MATERIAL AND MOUNTING BODY
摘要 PROBLEM TO BE SOLVED: To solve a problem that a conventional solder material does not necessarily exhibit a sufficiently high thermal fatigue property in soldering an Au electrode which is subjected to Au flash plating by flash treatment for plating thinly in a short time.SOLUTION: A solder material is utilized in soldering an Au electrode including Ni plating containing P, and contains 3-8 mass% of In, 0.3-4.0 mass% of Ag, and 0.4-0.6 mass% of only one kind of component among Cr, Ni, Fe, Co, Zn, Si, Ge, Ga, and Al, wherein the balance is 87.4 mass% or more of Sn.
申请公布号 JP2013193092(A) 申请公布日期 2013.09.30
申请号 JP20120060383 申请日期 2012.03.16
申请人 PANASONIC CORP 发明人 FURUSAWA AKIO;MORI MASAHITO;KITAURA HIDETOSHI;HINE KIYOHIRO
分类号 B23K35/26;C22C13/00;H05K3/34 主分类号 B23K35/26
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