| 摘要 |
PROBLEM TO BE SOLVED: To provide a basis material adhesion device and a basis material adhesion method which can bond basis materials overlapping each other with a shape along a curved surface easily.SOLUTION: A basis material adhesion device 1 bonding basis materials overlapping each other through temperature melting adhesive comprises: a solid support member 5 having a back face 3 which curves in a three-dimensional shape and supports the basis materials; press dies 7 facing the back face 3 of the solid support member 5; press means 9 pushing the press dies 7 to the basis materials supported on the back face 3 of the solid support member 5; and heaters 11 heating to and over the temperature that the adhesive melts. The heaters 11 are provided to the press dies 7, and elastomer is provided on the back face 3 of the solid support member 5. |
