| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which allows a package enabling highly reliable vacuum sealing etc. to be manufactured even when an insulation material is used as a base material, and to provide a manufacturing method of the circuit board.SOLUTION: A circuit board 1 includes: a glass substrate 2; a tapered through hole which vertically penetrates through the glass substrate 2; and a through electrode 3 formed by an alloy material made of two or more kinds of metals poured so as to close the through hole. Each metal, composing the alloy material, is formed so that the concentration of the metal in the alloy material differs along a radial direction and/or an axial direction of the through hole. |
