发明名称 HALO-HYDROCARBON POLYMER COATING
摘要 <p>87SIn some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of10 the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.15Figure Nos. IA, 1B and 1C</p>
申请公布号 SG193213(A1) 申请公布日期 2013.09.30
申请号 SG20130062617 申请日期 2009.08.11
申请人 SEMBLANT LIMITED 发明人 HUMPHRIES, MARK, ROBSON;FERDINANDI, FRANK;SMITH, RODNEY, EDWARD
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