发明名称 |
HALO-HYDROCARBON POLYMER COATING |
摘要 |
<p>87SIn some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of10 the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating.15Figure Nos. IA, 1B and 1C</p> |
申请公布号 |
SG193213(A1) |
申请公布日期 |
2013.09.30 |
申请号 |
SG20130062617 |
申请日期 |
2009.08.11 |
申请人 |
SEMBLANT LIMITED |
发明人 |
HUMPHRIES, MARK, ROBSON;FERDINANDI, FRANK;SMITH, RODNEY, EDWARD |
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