| 摘要 |
PURPOSE: A method for manufacturing a chip package member and a method for manufacturing a chip package are provided to stabilize manufacturing processes by forming a bottom junction layer on an insulation film. CONSTITUTION: A bottom junction layer is formed on the lower surface of an insulation film (S1). A bonding layer is formed on the upper surface of the insulation film (S3). A base material is made. A through hole is formed on the base material (S5). A circuit pattern layer is formed on the boding layer (S7). [Reference numerals] (AA) Start; (BB) End; (S1) Bottom junction layer is formed on the lower surface of an insulation film; (S3) Bonding layer is formed on the upper surface of the insulation film; (S5) Through hole is formed on the base material; (S7) Circuit pattern layer is formed on the boding layer |
