OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

摘要

AN OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION INCLUDES A RUBBER-PARTICLE-DISPERSED EPOXY RESIN (A) CONTAINING AN ALICYCLIC EPOXY RESIN AND, DISPERSED THEREIN, RUBBER PARTICLES, IN WHICH THE RUBBER PARTICLES COMPRISE A POLYMER INCLUDING ONE OR MORE (METH) ACRYLIC ESTERS AS ESSENTIAL MONOMERIC COMPONENTS AND HAVE A HYDROXYL GROUP AND/OR A CARBOXYL GROUP IN A SURFACE LAYER THEREOF AS A FUNCTIONAL GROUP CAPABLE OF REACTING WITH THE ALICYCLIC EPOXY RESIN, THE RUBBER PARTICLES HAVE AN AVERAGE PARTICLE DIAMETER OF 10 NM TO 500 NM AND A MAXIMUM PARTICLE DIAMETER OF 50 NM TO 1000 NM, AND THE DIFFERENCE IN REFRACTIVE INDEX BETWEEN THE RUBBER PARTICLES AND A CURED ARTICLE OBTAINED FROM THE OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION IS WITHIN ±0.02. THE OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION CAN GIVE A CURED ARTICLE WHICH EXHIBITS EXCELLENT CRACKING RESISTANCE WHILE MAINTAINING SATISFACTORY THERMAL STABILITY AND HIGH TRANSPARENCY.