| 摘要 |
The present invention relates to: a method for plating printed circuit boards which is capable of electroplating on the seed layer in order to improve electrical conductivity without having to form a lead-in wire on the front surface of the printed circuit board, which has increased productivity by not using an etching process, and which is capable of minimizing pollutant generation; and a method for manufacturing flexible printed circuit boards using same. The present invention includes the steps of: forming at least one through hole which penetrates an area where at least one circuit pattern is to be formed on a substrate; forming the seed layer on one side surface of the substrate to correspond to the circuit pattern; forming a conductive via formed in the through hole so as to be connected to the seed layer from the other side surface of the substrate, and a plating power source lead-in unit for applying a plating power source to the seed layer through the conductive via; and forming a plating layer on the seed layer by applying the plating power source to the plating power source lead-in unit. |
