| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-contact IC mount board in which cost is reduced and reliability is improved by stably performing communicating operation while suppressing heating of an IC chip and a change in communication characteristics even if a high-output induction magnetic field is applied from a non-contact information reader/writer, and a non-contact IC card.SOLUTION: A non-contact IC mount board comprises a circuit board, an antenna circuit formed on a front side or a rear side of the circuit board, a terminal part formed in a portion of the antenna circuit, a dummy terminal part electrically independent of the terminal part, and an IC chip packaged in the terminal part and the dummy terminal part. In the non-contact IC mount board, a heat radiation pattern is disposed on the circuit board in an IC mounting part where the IC chip is packaged, and a conductor pattern area combining the terminal part, the dummy terminal part and the heat radiation pattern in the IC mounting part is formed to be substantially overlapped with the IC mounting part. |
